| SJ Inno Tech Releases HP-520SPI 3D SPI |
| Written by Mike Buetow | |||
| Wednesday, 28 November 2012 10:45 | |||
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HP-520SPI is closed-loop solder paste inspection system that provides real-time measurement and control of solder paste. Automatically adjusts squeegee pressure and speed, initiates screen cleaning sequence, and stops production if a PCB cannot be brought into programmed specification. Three-stage automatic conveyor buffers printed circuit boards on entrance and exit. Features edge clamping; programmable control of squeegee pressure during print stroke; servo-controlled support table. SJ Inno Tech, www.sjinnotech.com
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Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
