Inducted May 2012

Stanislaus F. Danko, born 1916, of the U.S. Armed Forces Signal Research and Development Laboratory co-developed the "Auto-Sembly" process, the first known dip soldering process using radial leaded components. The automated process punched holes in regular printed or etched electronic circuits, then dropped the component leads through the holes and dipped in a solder bath, soldering all connections in a single operation, the precursor to modern wave soldering. He an coinventer Moe Abramson were issued US PTO no. 2,756,485 for their invention. He graduated in 1937 with a bachelor's in electrical engineering from the Cooper Institute. He also testified as an expert witness for the defense in the famous Technograph Printed Circuits v. Bendix Aviation lawsuit, which pitted the inventor of the printed circuit against an alleged infringing party.