Inducted May 2012

It was 1949 when Moe Abramson, along with Stanislaus F. Danko, both of U.S. Armed Forces Signal Corps, invented the "Auto-Sembly" process, the first known dip soldering process using radial leaded components. Using their automated process, holes could be punched in regular printed or etched electronic circuits, then the component (resistors, tubes) leads were dropped through the holes and dipped in a solder bath, soldering all connections in a single operation, the precusor to modern wave soldering. The US PTO issued Abramson a patent for the idea in 1956. In 1957, Abramson was bestowed with what was at the time the largest cash reward ever made by the Army for an employee suggestion: a $10,000 award for the idea.