Moe Abramson Print E-mail


Inducted May 2012


It was 1949 when Moe Abramson, along with Stanislaus F. Danko, both of U.S. Armed Forces Signal Corps, invented the "Auto-Sembly" process, the first known dip soldering process using radial leaded components. Using their automated process, holes could be punched in regular printed or etched electronic circuits, then the component (resistors, tubes) leads were dropped through the holes and dipped in a solder bath, soldering all connections in a single operation, the precusor to modern wave soldering. The US PTO issued Abramson a patent for the idea in 1956. In 1957, Abramson was bestowed with what was at the time the largest cash reward ever made by the Army for an employee suggestion: a $10,000 award for the idea.



Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.



Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.





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