Alpha Introduces Lumet LED Materials Print E-mail

Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board assembly reportedly prints well, particularly with ultra fine feature repeatability (11 mil squares) and high-throughput applications. Lumet P34 is for long soak reflow profiles. Lumet P39 Pb-free, zero-halogen, no-clean solder paste is for LED assembly and other applications that must pass JIS Copper Corrosion test. Lumet P39 has clear, colorless flux residue; is for LED package-on-board assembly. Is designed to enable consistent fine-pitch printing capability to 180µm circle printed with 100µm thickness stencil. Lumet P52 Pb-free alloy has a melting point below 140°C, and has been used with peak reflow profiles between 155° and 190°C.

Alpha, http://alpha.alent.com/Markets/LED

 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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