| The Hurdles of New Technology Adoption |
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| Written by Dr. Ron Lasky | |||
| Thursday, 11 February 2010 09:57 | |||
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Every so often a new electronics assembly technology comes along, and I am asked my opinion about it. The latest “new” technology for assembly is RF Activated “Green” Nano Solder. My response when asked about this? I think Intel's caveat in the article tells it all: "Intel cautioned, however, that several engineering refinements need to be made before the new RF soldering method can be used commercially.’ Interpretation: This puppy needs $20 million of R&D before it is ready. Any new technology process must be evaluated under the following criteria:
Using these criteria, let’s look at the implementation of SMT technology in the age of through-hole (TH), circa 1980. How did it measure up to these four criteria?: 1. SMT met an overwhelming need. One simply could not design a small, high performance personal product, like a mobile phone, with PTH. 2. SMT lines evolved from PTH lines, sometimes with radical changes, but the need overwhelmed any disruption. 3. Much work was performed on SMT products to demonstrate that reliability was acceptable. 4. The need for SMT was so great that PTH's "future" was not an issue.Contrast this to the SMT process discussed above (that has 95% first-pass yield) with the 5% fallout reworkable. It becomes difficult to envision making any “disruptive” change to a process like this .. it just won’t pay financially or in any other way. Your comments? Dr. Ron Read more: http://blogs.indium.com/blog/an-interview-with-the-professor/0/0/an-interview-with-the-professor
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