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Written by Paul Lotosky   
Thursday, 31 March 2011 13:51


Control the humidity to enhance paste integrity.

Possible causes: Solder paste.

Description. Solder paste, especially water-soluble versions, which are hygroscopic, tend to have limited stencil life because of moisture absorption.

Recommendations.

  • Minimize exposure time.
  • Printer temperature and humidity should be within recommendation.
  • Try new lot of solder paste to verify paste integrity.
  • Use coarser powder size if possible, as fine powder size has more oxides and tends to slump more readily.

Paul Lotosky is global director – customer technical support at Cookson Electronics (www.cooksonelectronics.com); This e-mail address is being protected from spambots. You need JavaScript enabled to view it . His column appears monthly.

Last Updated on Thursday, 31 March 2011 16:56
 

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