Insufficient Fill Print E-mail
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Written by Paul Lotosky   
Friday, 07 January 2011 16:26

What to do when solder isn’t penetrating the aperture.

Insufficient fill occurs when the amount of solder paste deposited on a printed circuit board by the printer is much less than the stencil opening design.
Among the potential causes:

Stencil: Paste scooping effect, especially on large pads.
Recommendation: Segment the large opening into smaller apertures.

Screen printer:
Paste does not roll into aperture.
Recommendations:

  • Reduce print speed.
  • Increase print pressure.
  • Adopt lower squeegee contact print.
  • Ensure paste is not expired or dry.
  • Ensure sufficient board support.
  • Reduce squeegee pressure.

Paul Lotosky is global director – customer technical support at Cookson Electronics (cooksonelectronics.com); This e-mail address is being protected from spambots. You need JavaScript enabled to view it . His column appears monthly.

Last Updated on Friday, 07 January 2011 19:00
 

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