ICT Boundary Scan Development Steps Print E-mail
User Rating: / 0
PoorBest 
Written by Jun Balangue   
Monday, 06 December 2010 17:42

Test point access and good data make all the difference.

Boundary scan is a limited access solution created to recover the coverage when test access is lost on a PCB. Test development is one of the critical stages to determine the success of boundary scan implementation at in-circuit test. This month, we look at several boundary scan ICT test development steps.

PCB boundary scan test point access. A critical step in implementing boundary scan test successfully is to ensure that access to test points is available for nodes needed for the test. Analyzing probe access on boundary scan using available ICT tools allows the test engineer to review the test access on the PCB.

One challenge of IEEE Std. 1149.1 and IEEE Std. 1149.6 implementation on PCBs is the availability of a compliant BSDL that is physically verified from the silicon. A BSDL file provided by the ICT is the only link between the test development engineer and the silicon device that describes the correct boundary scan cell type, sequence and number of cells, manufacturing identity code, boundary scan register length and other related information (Figure 1).



Figure 2 illustrates the importance of a BSDL test. In this case, an interconnect test with an inaccurate BSDL file describing a device will have a catastrophic effect on the boundary scan testing, and result in an inaccurate failure analysis. A missing internal cell in the BSDL will result in a wrong boundary register description, and every device in the chain between the wrongly described device and TDI would be offset by the inaccuracy. A missing control cell in a BSDL designed to disable a pin would fail with incorrect diagnoses.



Boundary scan test generation. Once the boundary scan devices, BSDL and board topology are described to the ICT development software, boundary scan test generation is automatic. The information provided permits the system to identify boundary scan devices and test types to be generated. The boundary scan tests are also executed in a sequence that helps identify failures and ensure the power is off to prevent further damage to the PCB. 

ICT development software can generate the following boundary scan test (Figure 3):

 

  • Boundary scan disable. Disables output pins of all boundary scan devices in a boundary scan chain.
  • Interconnect test. Generates interconnect test for IEEE Std. 1149.1 and IEEE Std. 1149.6 cells. Interconnect test checks for shorts, but most opens will also be detected for connection in between boundary scan cells and devices.
  • Buswire test. Generated on bussed boundary scan cell drivers in a boundary scan chain. During buswire test, it turns on boundary scan drivers one at a time to check for opens, as well as verify the operation of bidirectional pins to check the operation, first as drivers, then as receivers.
  • Powered shorts test. Tests for solder shorts in between boundary scan nodes and pins that do not have test access and node/pins that have test access physically close to each other. Tests selected boundary scan driver cells; those not selected are tested only as receivers.
  • Connect test. Checks for open pins on boundary scan cell drivers and receivers of devices that have test probes assigned. For larger devices that exceed the available number of testhead resources (for example, testing a 300-pin ASIC when only 200 resources are available), or to minimize ground bounce caused by too many simultaneous transitions, automatically split the connect test into two or more smaller tests.
  • Silicon nail test. Uses Boundary Register cells to replace physical probes or nodes. The Boundary Register cells that act as drivers and receivers, as shown in the device between the boundary scan devices, are typically a non-boundary scan part or a small cluster.
  • Cover-Extend. A hybrid between vectorless test and boundary scan. Uses a sensor plate to detect signals on each connector or non-boundary scan device pins connected to boundary scan cell drivers.

Developing ICT boundary scan tests. Here are best practices during boundary scan test development; all possible areas that could cause problems during testing are considered:

  • Grounding is very important in any powered test in ICT. Make sure the board and test fixture have sufficient ground paths and returns for the types of devices to be tested. In particular, carefully consider boundary scan devices that will employ connect tests. If one of these devices has a large number of output pins that will be exercised during a connect test, grounding should be increased to prevent inadvertent state changes.
  • ICT test development software typically should be able to minimize ground bounce by turning on ground bounce suppression during development. The boundary scan test generated by the software adds extra clock cycle to the test where state changes might cause a ground bounce.
  • To ensure signal quality to the TAP (TDI, TMS, TCK and TDO), it should have the shortest twisted pair wire from probes to the test probe. This can be done by assigning a “CRITICAL” attribute to the TAP during development. The ICT test development software will assign the TAP first during probe placement to ensure the shortest wire in the fixture.
  • TAP probe access should always be placed at the bottom of the PCB in order to have the shortest wire possible.
  • Like any digital test, a boundary scan test should be treated the same. All surrounding digital devices and locks should be disabled to prevent interference to the boundary scan devices. The ICT test development software automatically generates a boundary scan test that will disable surrounding devices if you declare to the software how the device can be disabled.

Bibliography
1. Kenneth P. Parker, Boundary Scan Handbook, 3d edition, 2003.
2. Agilent Medalist i3070 online help.
3. Agilent Medalist i3070 Boundary Scan training manual.
4. Jun Balangue, “Successful ICT Boundary Scan Implementation,” CIRCUITS ASSEMBLY, September 2010.

Jun Balangue is technical marketing engineer at Agilent Technologies (agilent.com); This e-mail address is being protected from spambots. You need JavaScript enabled to view it .

Last Updated on Monday, 06 December 2010 19:00
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Techspray Introduces Fine-L-Kote High Viscosity AR Conformal Coating
Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems...