Solder Flooding Print E-mail
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Written by Paul Lotosky   
Tuesday, 11 May 2010 22:46

Board positioning in the wave is crucial to avoid solder from covering components.

Flooding is a condition whereby solder “flows over,” thus causing the solder to flood on the component.

The primary assembly process setup areas to check:

  • Board may be warped: need center support in the wave.
  • Wave height too high.
  • Conveyor too tight or too loose.
  • Other things to look for in the assembly process:
  • Solder temperature too high.
  • Preheat too high.    
  • Board not seated properly.
  • Solder temperature too low.    
  • Preheat too low.    
  • Board rerun.
  • Solder wave height high.    
  • Conveyor speed high.    
  • Defective fixture.
  • Solder wave uneven.    
  • Conveyor speed low.

Things to look for with the bare board fabrication:

  • Board warped.    
  • Things to look for with the board design:
  • Poor pallet design.    
  • Board size.    
  • Weight distribution.

Last Updated on Wednesday, 12 May 2010 17:33
 

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