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Monday, 31 October 2011 15:25

Conductive Adhesives
“Using Anisotropic Conductive Adhesives in Advanced Medical Applications”
Author: Peter J. Opdahl
Abstract: Anisotropic conductive adhesives make both the mechanical and electrical connection between two devices. They have been shown to provide mechanical connections at peel strengths up to 20N/cm, electrical connections at pitches down to 0.035mm pitch with minimum 0.010mm space between contacts and minimum 1500µm2 contact pitch. The typical contact resistance is 5-7mΩ for Au-Au bonds; 10-8Ω (10-7Ω after aging) electrical isolation. Under study, electrical characteristics are good at >20Ghz frequencies. Adhesives are typically epoxy for medical applications, but are also available in acrylic/epoxy hybrids and as hot-melt adhesives. Particles can either be solid metal particles or Ni Au plated compressible plastic spheres. (MEPTEC 2011 Medical Symposium, September 2011)

Embedded Components
“Disappearing Die: The TIPS Project”
Author: Martin McHugh; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Abstract: TIPS is a European sponsored effort to stack multiple layers of die, with more die “disappearing” into the PCB. It is a follow-on project to SHIFT, which demonstrated the reliability of embedded die. The scale of reduction is one-fourth the original module (from 0.16 sq. in to 0.04 sq. in). Another objective of TIPS is to work in volume rather than planar surfaces of the PCB. The two technologies studied were ultra thin die in polyimide, and thin die in PCB lamination. In one example, four EEProms of 70µm each were stacked. A 60% space savings can be achieved by die stacking. TIPS was also shown to have certain advantages over package-on-package (PoP), including a single module (so lower yield loss), more flexible package design, and better miniaturization. (MEPTEC 2011 Medical Symposium, September 2011)

Medical Electronics
“Microelectronics Packaging for Medical Implants”
Author: Faina Zaslavsky; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Abstract: Placing devices in children as young as 12-months-old required lighter and smaller implants. A microelectronics circuit was assembled, electrically tested and environmentally screened to the prescribed customer specification. Assembly and screening sequence was based on MIL-PRF-38534. The second generation of the implant electronics was assembled on green organic board with ASICs configured into CSPs. Changes in the configuration and assembly techniques permitted the additional weight and size reduction without compromising device reliability. (MEPTEC 2011 Medical Symposium, September 2011)

Nanostructures
"Nanoparticle Superlattice Engineering with DNA"
Authors: Robert J. Macfarlane, Byeongdu Lee, Matthew R. Jones, Nadine Harris, George C. Schatz and Chad A. Mirkin; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Abstract: A current limitation in nanoparticle superlattice engineering is that the identities of the particles being assembled often determine the structures that can be synthesized. Therefore, specific crystallographic symmetries or lattice parameters can only be achieved using specific nanoparticles as building blocks (and vice versa). We present six design rules that can be used to deliberately prepare nine distinct colloidal crystal structures, with control over lattice parameters on the 25nm to 150nm length scale. These design rules outline a strategy to independently adjust each of the relevant crystallographic parameters, including particle size (5nm to 60nm), periodicity, and interparticle distance. As such, this work represents an advance in synthesizing tailorable macroscale architectures comprising nanoscale materials in a predictable fashion. (Science, Oct. 14, 2011)

PCB Substrates
“Substrates for Medical Implantable Applications”
Author: Dr. Marc Hauer
Abstract: Minimizing the interconnect simplifies interconnects within a device. Ideally all components should be connected with a single technology (i.e., soldering), which minimizes design restrictions on the substrate and reduces substrate and assembly cost. Reducing the number of interconnect levels within a device permits a direct interconnect to component, and choosing the right substrate can avoid interposers. (MEPTEC 2011 Medical Symposium, September 2011)

This column provides abstracts from recent industry conferences and company white papers. Our goal is to provide an added opportunity for readers to keep abreast of technology and business trends.

Last Updated on Tuesday, 01 November 2011 11:42
 

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