Area Array Packaging Handbook Print E-mail
User Rating: / 0
PoorBest 
Written by Bob Willis   
Wednesday, 29 October 2003 19:00

ImageKen Gilleo
Published by McGraw-Hill Handbooks

This book has 31 chapters covering all you need to know about the use, design, assembly and inspection of area array devices. It also outlines the implications and challenges for new processes and materials. The text reads well and is illustrated with products, process issues and equipment shots. Any engineer would benefit from a close reading of the text; his company would benefit also. Of particular interest were the sections by Daniel Baldwin on flip chip and the reliability section by Raza Ghaffarian. Of course, Gilleo holds things together, creating a smooth transition between topics. Many other books with multiple contributors have trouble with the transitions linking chapters.

Gilleo explains the introduction of flip chip technology in the 1960's and the problems faced by the early innovators. This chapter, which includes over 20 pages, starts at the beginning with IBMÕs use of direct chip attach (DCA) and also acknowledges Fairchild for their early contribution. The chapter brings the reader through the stages of innovation and does not really conclude since the technology moves on each day. Gilleo also outlines the growing demand for microelectromechanical systems (MEMS), which could (and probably will) be a book in its own right.

Marie Cole provides insight into ceramic ball and column grid array packages that is informative, just like her workshops for IBM. I was most interested in the simple techniques used to rework ceramic components; it is amazing what can be done with bath of hot oil and a squeegee blade.

I was disappointed that it took a trip to the U.S. to get a copy of the book from the McGraw-Hill offices. When so much effort is put into releasing so many strong titles in the electronics field, other offices should promote the products more aggressively.

I look forward to meeting Ken Gilleo again during one of his workshops and getting him to sign my copy of the book. Perhaps I should wait and get him to sign the second edition, which I believe is even bigger and heavier.


 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Yincae Rolls Out ACP120 Solderable Coating
ACP 120 series anti-oxidation solderable coatings replace nanofilm gold. Are for anti-corrosion and anti-rusting on solderable surfaces on which solder paste, solder preform or a solder ball can be...