| Electronic Connector Handbook |
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| Written by Bob Willis | |||
| Tuesday, 25 March 2003 19:00 | |||
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Very few books dedicated to connectors exist. In fact, this is only the second book that I am aware of in the industry and the first that is a dedicated manual. The book covers, in detail, the many forms of interconnection with special attention paid to electrical and mechanical aspects. More discussions of applications would have been beneficial since the assembly issues were not fully addressed. It would have been helpful to have a section from AMP on pin-in-hole reflow for conventional parts since it is so pertinent right now. The chapter on crimping and IDC assembly is one of the best I have seen. More space should, however, have been given to preparation of cables for all types of the compression joint. With this topic added, the book could then be used as a training manual for production staff as well as an engineer's manual. The section on press fit was very interesting, but did not cover the use of different solder finishes on boards. The type of solder to be used is now a topic of debate. What should we use? Copper, tin/lead or gold? This title is, on the whole, a great reference book. Electronics Manufacturing with Lead-Free, Halogen Free & Conductive
Adhesive
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Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
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Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
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| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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Products
Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...


By Robert S. Mroczkowski