| Engineers Handbook of Encapsulation and Underfill Technology |
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| Written by Bob Willis | |||
| Tuesday, 25 March 2003 19:00 | |||
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This is one of the first textbooks to be released on the use of encapsulants and underfills, and it makes a good companion to the flip chip books by John Lau. Other technology reports exist, but Martin Bartholomew, from Multicore, has provided a very useful reference source. The book covers materials, applications and assembly issues, and provides helpful illustrations at each stage. It does, however, fall short of providing good photographs of products and the assembly techniques. The text would have benefited from more examples of products that are well documented in the industry.
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By Martin BartholomewColumns
| Semblant Warms to New Fluoroolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
| Read more... |
| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
| Read more... |
Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
| Read more... |
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TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...
