Solders and Soldering - Fourth Edition Print E-mail
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Written by Bob Willis   
Tuesday, 25 March 2003 19:00

ImageBy Howard Manko
McGraw Hill

This book is considered an engineering bible on soldering materials and processes. It was originally published in 1976 and now sees its fourth release with updates in a number of areas. The text has been updated, but where the changes have been made is not obvious. Much more of the book could have been updated, especially with regard to lead-free soldering and solders, selective soldering, flip chips, ball grid arrays (BGAs) and microBGAs.

If you need a good reference book on soldering, this book is one. However, I don‚t recommend this book if you are considering updating from the last edition. The updates provided don‚t justify an upgrade.

Last Updated on Friday, 31 December 2004 10:00
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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