| SJ Inno Tech Releases HP-520SPI 3D SPI |
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HP-520SPI is closed-loop solder paste inspection system that provides real-time measurement and control of solder paste. Automatically adjusts squeegee pressure and speed, initiates screen cleaning sequence, and stops production if a PCB cannot be brought into programmed specification. Three-stage automatic conveyor buffers printed circuit boards on entrance and exit. Features edge clamping; programmable control of squeegee pressure during print stroke; servo-controlled support table. SJ Inno Tech, www.sjinnotech.com |
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| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
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| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
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| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
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535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
