These files are very large so we have decided not to post them here. If you are a subscriber (digital or print) to Printed Circuit Design & Manufacture or Circuits Assembly, you can get a CD with the contents of those proceedings, FREE OF CHARGE!!. Just click on this link and supply the required information and we will send you a CD, FREE! We'll even pay the postage.

If you are not a subscriber to PCDM or CA (and why wouldn't you be), the proceedings are available for a modest fee.

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To subscribe to Circuits Assembly, please click here to open a subscription form in a new window. Subscriptions take approximately six to eight weeks to process.

If you have any questions, please contact Jennifer Schuler, jschuler@upmediagroup.com.

...in the magazine and on the web site

Your news item or product release must be of interest to the printed circuit assembly industry. Specific areas of interest for news include acquisitions, relocations, openings, closings, promotions, research programs, market studies, contracts, appointments, conference and tutorial locations and dates.

Your news must be current. Keep in mind that an average time of at least two months will pass before you see your news in print.

News for the web site is gleaned from the same information received for the magazine and is published on an as-received basis at the discretion of the editors.

Restrict yourself to a page or, at the most, two pages, and focus only on those details pertinent to the issue being discussed.

For new products, your release must cover a product or service that would be purchased by a printed circuit assembly professional.

News items, product releases, etc., may be sent electronically or by hard copy. Our editors prefer to received releases electronically.

Press releases sent electronically should be transmitted within the body of the message or sent as Microsoft Word attachments. Photos should be sent as .eps or .tif files. Include full contact information including company name, complete address, contact person and phone number. All material should be sent to: cdrysdale@upmediagroup.com.

Prepare the hard copy as follows:

• Type on one side only on 8-1/2" x 11" paper, double spaced.
  
  
• Use corporate stationery with letterhead for the first page. Include a full address with a contact person's name and phone number at the end of the release.
  
  
• Photos: Send good-quality, well-lit color prints. Identify the photo with a caption. Circuits Assembly reserves the right to edit or reject press releases, and we cannot guarantee a release will run in a specific issue.

For additional information or assistance, contact our editorial office at:

Circuits Assembly
UP Media Group
2400 Lake Park Drive
Suite 440
Smyrna, GA 30080
Phone: (678) 589-8846
Fax: (678) 589-8850
E-mail: cdrysdale@upmediagroup.com

There are specific guidelines for submitting articles to CIRCUITS ASSEMBLY. These guidelines are based on achieving simplicity both in communicating to our audience and in working with the editors.

Submission Requirements

• Explain how the new technology helps an assembler do their job better. Explain - specifically - how it works, and the impacts (again, specifically) on the assembly process.
• Contain hard data. (This is not to be confused with generalities and potentials and possibilities). Furthermore, any data should be current; not rehashed statistics.
• Data should be presented in a visually stimulating form (graphs and models, not just tables and formulas).
• Data should be comparative to a current process or a competitive method.
• Draw conclusions and state them prominently; don't just let the reader draw his/her own conclusions.

• Source.
• Author.
• Page numbers.
• Date.
• Place (if presented at a conference).

Adverse Outcomes

Our expectation is that your article proposal will include full, accurate and up-to-date reporting of adverse events or outcomes pertaining to the use of any processes or products described.

Electronic Transfer

Copyrights

Deadlines

Editorial Calendar

Article Length

Graphic Requirements

Suggested Technical Article Format

1. Makes/models of equipments or materials
2. A list of standard (e.g., IPC, ASTM, etc.) test methods used and/or
3. An explanation of any nonstandard test methods used

1. Explanation/discussion/analysis of what was found
2. Description of other work, if any, that will be undertaken related to the study described

4. Conclusions
5. References to related literature
6. Author bio(s)

Suggestions