Somerset, NJ – March 27, 2017 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be presenting two technical papers “Flip-Chip LED Assembly – Processes and Challenges” and “LED Assembly on Flexible Substrates” at the South East Asia Technical Training Conference on Electronics Assembly Technologies 2017 which is hosted by SMTA from March 28-30, 2017 at Oliver Tree Hotel in Penang, Malaysia.

The first paper titled “Flip-Chip LED Assembly – Processes and Challenges” will discuss on the effect of application process, process settings and solder paste on assembly outputs. This study is relevant for LED packaging and LED module assembly makers who use flip chip for automotive, backlight and general lighting applications. The second paper titled “LED Assembly on Flexible Substrates” will provide insight into the world of LEDs on flexible circuits. The presentation includes end-applications and drivers for LED on flex including material stack selection particularly, details on low to mid temp alloys and interconnects on both polyimide and PET based circuits. Additionally, the impact / performance of typical material stacks in the form of applications studies will be reviewed and lastly the future of flexible circuitry form factor evolution will be discussed. For more information on Alpha’s vast product offering and capabilities, please visit AlphaAssembly.com or the detailed agenda of conference at www.smta.org/southeast-asia/

TECHNICAL PAPER PRESENTATION:

Wednesday, 29th March 2017 | 03:00-03:30

Topic: Flip-Chip LED Assembly – Processes and Challenges

Speaker: Gyan Dutt, Technical Marketing Manager of LED – Alpha Assembly Solutions

Wednesday, 29th March 2017 | 04:00-04:30

Topic: LED Assembly on Flexible Substrates

Speaker: Amit Patel, Project Manager of LED – Alpha Assembly Solutions  

Speakers’ Biography

Gyan Dutt works for Alpha as Technical Marketing Manager for LED Technologies. He is responsible for the planning, organization and implementation of the ALPHA® product portfolio for LED packaging, interconnect and assembly. He has more than 13 years of experience in technical marketing, product development and applications engineering in semiconductor packaging in the US and Asia-Pacific Regions. Amit Patel is the Project Manager - Engineer, for the LED Technologies division at Alpha Assembly Solutions, South Plainfield, NJ. In his current role he is instrumental in planning, coordinating and executing market research, and applications research for the design and implementation of electronic assembly materials for all levels of LED manufacturing, from LED die attach to module/luminaire assembly. Amit holds a Bachelor’s degree in Electrical Engineering from The New Jersey Institute of Technology. He is also an trained Six Sigma Black Belt. He co-wrote the iNEMI Solid State Illumination Technology Working Group for the 2015 roadmap cycle So far, He has published 3 papers in the areas covering Assembly Processes, and Thermal Management for the solid state lighting industry. ###

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