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Written by Jan Vardaman
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Robotics, wearables and the Smart Factory were hits at InterNepcon.
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Written by E. Jan Vardaman
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Packed sessions highlight fan-out wafer level packaging trends.
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Written by E. Jan Vardaman
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InterNepcon was fertile ground for next-generation technology.
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Written by E. Jan Vardaman
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Its economy may feel turmoil but government policies should boost its semiconductor sector.
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