In the latest issue of the Global Semiconductor Packaging Materials Outlook, organic substrate represents more than one-third of the semiconductor materials market. The main reason for this high value is the growth of flip-chip substrates, which are typically more expensive than wirebond packages.
As our company celebrates its silver anniversary, I started to reminisce about the progress made in the electronics industry over the last 25 years. It has been a remarkable journey.
A cloudy global economic forecast is causing uncertainty among many corporations, even those in the electronics industry. While last year’s worries were caused by natural disasters, 2012 fears are manmade.
A thousand people gathered at the Electronics Components and Technology Conference (ECTC) in Orlando, FL, last month to discuss the latest trends in electronics packaging and assembly.