Forefront

Cost remains king, even as buildup substrates take hold.

In the latest issue of the Global Semiconductor Packaging Materials Outlook, organic substrate represents more than one-third of the semiconductor materials market. The main reason for this high value is the growth of flip-chip substrates, which are typically more expensive than wirebond packages.

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Is failure not just an option, but a necessity?

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Will future developments in packaging and assembly be joint efforts?

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The author celebrates her quadranscentennial and considers the next one.

As our company celebrates its silver anniversary, I started to reminisce about the progress made in the electronics industry over the last 25 years. It has been a remarkable journey.

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The supply chain was hit hard in 2011. It’s unclear whether 2012 will bring a reprieve.

A cloudy global economic forecast is causing uncertainty among many corporations, even those in the electronics industry. While last year’s worries were caused by natural disasters, 2012 fears are manmade.

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3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.

A thousand people gathered at the Electronics Components and Technology Conference (ECTC) in Orlando, FL, last month to discuss the latest trends in electronics packaging and assembly.

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