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Forefront

Robotics, wearables and the Smart Factory were hits at InterNepcon. 

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E. Jan Vardeman

Packed sessions highlight fan-out wafer level packaging trends.

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E. Jan Vardman

InterNepcon was fertile ground for next-generation technology.

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E. Jan Vardaman

Its economy may feel turmoil but government policies should boost its semiconductor sector.

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E. Jan Vardaman
Will economics drive the next round of package innovation?

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E. Jan Vardaman
Wafer-level packaging packed the record house.

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