Once upon a time, there were many major computer makers in the world, and they developed and marketed expensive high end computational systems, spent a lot of money developing cool technology, and had impressive manufacturing operations.
When one considers hotbeds of high-tech education and training, Elyria, Ohio, isn’t the first place that comes to mind.
Old technologies never die; they just get new names. Flex circuits have been around for many years in the IC packaging business and have been called almost as many names. In the early days, it was tape automated bonding (TAB).
My columns have traditionally discussed the choices that EPIC has made in its Lean manufacturing strategy implementation. What hasn’t been covered is the basic groundwork analysis every company should go through when considering whether Lean is a good fit.
Having covered the Asian test and inspection markets for over a decade, I recently made my maiden voyage to Latin America to visit in-circuit test customers for a series of users group meetings.