caLogo

Features Articles

David BernardWhen nondestructive methods are preferred, leverage the x-ray.

Read more ...

Robert BoguskiWe came. We saw. We conquered. And we completed the questionnaire.

Read more ...

Jerry JohnsonTen steps for achieving good design for excellence.

Read more ...

Peter BigelowThe dwindling number of large, all-in-one companies belies the abundance of blooming small ones.

Read more ...

Mike BuetowStill inspired by the session on the “The Future of PCB Engineers” from PCB West last fall, I spent my early December poring over courses at universities across the US, looking for signs of printed circuit board instruction. I’m happy to say it was a fruitful exercise.

Read more ...

Mike BuetowSpeaking, as we were last month, about roadmaps, their role, who uses them and how, I call your attention to the retrospective that begins on page 27 of this month’s issue. It’s a reflection of the early days of the IPC Roadmap, which was published some 25 years ago.

As with our other year-end retrospectives on the introduction of RoHS and its effective ban on leaded solder and the launch of the IPC Designers Council, we wanted to capture the recollections of those who were on the front lines of the project. (A sad omission: Dieter Bergman, the project’s biggest champion and perhaps the one person most responsible for the first couple iterations, passed away in 2014. I still miss you, Big Guy.)

In 1993, of course, the electronics supply chain was a very different animal. Outsourcing wasn’t new, but it hadn’t taken hold in all corners, especially assembly. AT&T, IBM, H-P, Texas Instruments and Digital Equipment were among the leaders in vertical manufacturing. Many technologies accepted as routine today (SMT and HDI among them) were still finding their way – or hadn’t even made it off the drawing board.

Read more ...

Page 67 of 148

Don't have an account yet? Register Now!

Sign in to your account