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Assembly and Rework of Lead Free Package on Package Technology

Authors: Raymond G. Clark and Joseph D. Poole

Abstract: Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate
technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stack Save ing
packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package
(PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the
preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability
to assemble and rework numerous “state of the art” packaging technologies. This paper will focus on the essential
engineering development activities performed to demonstrate TT Electronics’ ability to both assemble and rework PoP
components.

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