BIG ISLAND, HAWAII – The 23rd Annual Pan Pacific Microelectronics Symposium has finalized its program. The event will take place Feb. 5-8 on the Big Island of Hawaii.

More than 50 technical sessions will include automotive systems and hardware, materials and reliability, inspection and test techniques, cleaning technologies, advanced materials, interposer and packaging technology, advanced processes and packaging, nontechnology applications, advanced packaging and processes, advanced process, and heterogeneous integration.

A keynote session will feature presentations on defense electronics; the latest material technologies for systems in package; management of complexity in research and development work; and selected highlights from the 2017 iNEMI Roadmap and key projects to address identified gaps.

Yoshiaki Sakagami of Honda will deliver a keynote on Honda’s New Mobility System Development Challenge; Key Functions and Devices for Intelligent Mobility System. In addition, Dwight Howard of Delphi Automotive will deliver a keynote on Integrated Intelligent Transportation and Key Enablers. Finally, Dongkai Shangguan, Ph.D., Flex, present Cost-Effective Solutions for SiP and Miniaturized Modules.

To view the complete program and register, visit https://www.smta.org/panpac.

 

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