LONDON – The global printed circuit board market is expected to grow at a CAGR of more than 6% from 2017 to 2021, says Technavio.
The deployment of next-generation wireless networks such as Wi-Fi, WiMAX, 3G/4G, and ultra-wideband requires a highly centralized and decentralized base station and a complex telecommunication network infrastructure. This requires high-performance printed circuit boards for broadcasting networks, says Technavio. In addition, rising virtualization and cloud computing is surging Internet traffic worldwide, which is expected to increase infrastructure spending by service providers.
“This segment requires a wide range of printed circuit boards, which are crucial for the functioning of communication network infrastructure equipment. Different types of electronic components are used in numerous communication network infrastructure devices, and all connect electrically with the help of printed circuit boards,” says Raghu Raj Singh, a lead analyst at Technavio for embedded systems research.
Smartphone giants Apple and Samsung are expected to feature next-generation boards, such as substrate-like printed circuit boards, in the upcoming iPhone 8 and Samsung Galaxy Note 8. SLP will double efficiency, while reducing the width and area, says the research firm.
And demand for PCBs is directly proportional to electronic components in the automotive segment.
“Safety regulations by the government have led to a major boost in the incorporation of electronic applications in automotives. Driver safety and fuel emission impact on the environment is the primary driver of the auto electronics market. In terms of commercial vehicles, automotive manufacturers must meet the specified performance standards set by the government. This augurs well for the growth of the printed circuit market,” said Raghu.