annually provides attendees and vendors with a conference and exhibition focused on the design and manufacture of PCBs, high density interconnect and other advanced circuits.
Printed Circuit Design & Fab and Circuits Assembly magazines are sponsoring the event.
The five-day conference program focuses on PCB engineering, design and fabrication. The conference is comprised of a 3-Day Technical Conference and a Professional Development Certificate program of one-day and two-day courses.
2008 also includes a two-day exhibition of top industry vendors to be held on Sept. 16-17.
Papers and presentations of the following durations are sought for the 3-Day Technical Conference:
30-minute paper sessions
One-hour lectures, presentations or panel sessions
Two-hour workshops or panel sessions
Half-day (3.5 hour) seminars
Papers and presentations of the following durations are sought for a Professional Development Certificate program of in-depth courses:
One-day tutorials (7 hours of instruction)
Two-day tutorials (14 hours of instruction)
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
If selected for PCB West
2008, final papers and presentations will be due in May.
Suggested paper and presentation topics include (but are not limited to):
High speed, high frequency and signal integrity
Lead-free processes (especially how they affect design and fabrication)
RF and microwave design
FPGA design and implementation
Embedded passives and active devices
HDI design and technologies
PCB design/layout basics
Component library creation and management
Design for manufacture, test and assembly
Design (including analog, digital and power supplies
Business and design/supply chain issues