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Sarcon 30XR-m is a high-performance thermal interface material that exhibits low thermal resistance.

Is 0.3mm thick. Available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit application shape. When placed between a heat source such as a semiconductor and a nearby heat sink, it provides thermal conductivity of 17.0 W/m•K and thermal resistance of 0.30°C•in2/W. Silicone-based material fills air gaps between uneven components, board protrusions and recessed areas.

Fujipoly America 
fujipoly.com

 

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