TGF 1500RW Berquist liquid gap filler is a one-part, cure-in-place thermal interface material for use with automated dispensing equipment for high-volume manufacturing operations.

Is applied as a liquid; is ideal for miniaturized, high-density assemblies and complex architectures. Provides thermal transfer with a 1.5W/m-K thermal conductivity. Reportedly delivers excellent low- and high-temperature mechanical and chemical stability. Peels cleanly from contact surfaces.

Henkel North America
henkel-adhesives.com/thermal

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