Heraeus F 498 Pb-free, low-temperature solder paste is designed for low mid-chip balling.
Features BiSn57Ag1 alloy for automotive, LED Level 2 and consumer electronics. Is designed for step-soldering when a second, lower temperature reflow process is needed. Is reportedly ideal for temperature-sensitive components, as well as low-melting, flexible circuitry used in smart devices. Offers excellent wetting performance on iSn and NiAu. Provides low beading and is RoHS compliant. Supports switch from wave-soldering to SMT. Operating temperatures up to 110°C are achievable.