Alpha OM-550 low temperature solder paste pairs with HRL1 alloy for assemblies with temperature-sensitive substrates, components and high-warpage chips. Reduces soldering temperature required for SAC alloys by 50°C, while reducing power consumption and carbon emissions.
Is said to reduce up to 99% and significantly reduce defects. Has characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures, therefore minimizing NWO and HIP defects in complex assemblies.
Alpha Assembly Solutions