SMT Releases R360 Reflow Soldering Oven
Published: 05 January 2018
R360 forced convection reflow soldering oven features a new airflow concept said to reduce energy consumption, whereby air moves from the fan to the PCB, then through a baffle plate, filter and heat exchanger.
Has eight heating and four cooling zones. Implements gas cleaning in each zone. Complete transport mechanism is separate from process gas stream. Precise nitrogen control. Industry 4.0 compatible.
SMT
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