SMT 158HA is an amine-based high-purity liquid epoxy encapsulant.

Is a slow-cure underfill designed for large components with small bumps and applications with strict environmental regulations. Is highly viscous and permits air to escape from gap during underfilling process. Slow cure permits air bubbles to migrate to the edge and escape. Design creates conditions to lead to a void-free underfill. Components exhibit lower thermal stress and improved reliability. Has a CTE of 20ppm/K, a glass transition temperature of 156°C, is fast flowing, and offers adhesion strength.

Yincae Advanced Materials
yincae.com

 

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