Master Bond Releases EP110F8-5 Potting Epoxy
Master Bond EP110F8-5 potting, sealing, encapsulation and casting epoxy is dimensionally stable and has low shrinkage upon cure.
Features superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, Dk of 2.91 at 1 KHz and Df of 0.009 at 1KHz. Heat-curable two-component epoxy has 1:2 mix ratio by weight with a moderate mixed viscosity of 7,000-11,000 cps and good flow properties. Cures at 250-300°F in 4-6 hours. Pot life is 2-3 days at room temperature. Shore D hardness of 70-80; elongation 40-60%. Passes 10 thermal shock cycles of -55° to +125°C. Compressive strength 18,000-20,000 psi. Adheres to a variety of substrates, including metals, composites, glass and many plastics. Resists exposure to water, oils and fuels. Serviceable temperature range is -100° to +300°F.
Master Bond
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