AIM Solder Debuts REL22 Low Ag SAC solder
Published: 24 February 2017
REL22 low Ag SAC solder contains bismuth and melts at about 208°C.
Reduces pin-holes on SMT solder joints and voiding on BTC components. Is suited to extreme thermal exposure operating environments such as under-hood automotive and avionics/aerospace. Low creep rates. Wider process window than Sn/Ag/Bi/Sb/Ni/Cu. Mitigates tin whisker growth. Available in bar solder, wire solder, solder paste
AIM Solder
www.aimsolder.com/products/high-reliability-alloys
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