News
Genesis Electronics Manufacturing Inc. (GEM, Tampa, FL) has transitioned its operations to a Tampa, FL, facility acquired in July 2003 from Jabil Global Services. GEM is a medium-volume, high-response electronics manufacturing services (EMS) provider.
In addition to nearly doubling GEM's physical space, the 50,000 sq. ft. facility expands the company's customer service offerings in the areas of equipment repair and service, specifically in the rebuilding of monitors, keyboards and telecommunications equipment. Test, repair and refurbishment equipment were acquired along with the facility and GEM added 15 new employees to cover its new areas of service.
"By growing our team, our physical space and our equipment, GEM has the ability to fulfill the demands of this service contract and extend like services to existing and new accounts," said GEM president Robert Stoller.
The expanded offerings bring GEM closer to its goal of providing services similar to those provided by tier-one suppliers. "While our customer base is generally not considered to be the market of the tier-one suppliers, we want to offer our customers the gamut of services they need to market their products, and equipment repair and service is considered the last stage of product life management," Stoller said. "GEM looks forward to providing a domestic option to customers who desire to have their product built in the USA."
The company can now be reached at:
14201 McCormick Drive
Tampa, FL 33626
(813) 854-1661
Copyright 2004, UP Media Group. All rights reserved.
BTU International Inc. (North Billerica, MA), a supplier of advanced thermal processing equipment for semiconductor packaging, surface-mount and advanced materials processing, has announced the appointment of Tom Nash as vice president of marketing.
Nash joins the company as a member of the senior management team, reporting directly to Mark R. Rosenzweig, president and chief executive of BTU International. Nash will oversee all facets of corporate marketing, working closely with the executive team on corporate strategy as the company continues to expand its product and customer base.
"We are extremely pleased that Tom has joined our team," said Rosenzweig. "He brings a wealth of international business experience in the electronics and process control industries as well as valuable experience in strategic planning, acquisition analysis and new business development. Tom will utilize his skills and experience to guide our new product development program, implement strategies to increase our global market share and support our worldwide sales organization."
Nash has previously held positions in general management, executive sales and marketing management, as well as product development, during his career at the Black & Decker Corp., Vitronics Corp. and most recently as president of CIMCIS Ltd.
Copyright 2004, UP Media Group. All rights reserved.
SEICA Inc. (Methuen, MA), a provider of electronics testing and production solutions, will further enhance its support network in North America with the opening of a sales and support office in Santa Clara, CA. At a time when many of its competitors are dedicating their resources to the Asian market, Seica plans to provide a high level of support in any geography where it has customers needing services.
Having set up an office near Boston in 2003 to serve the East coast, the new West coast office will provide local support for new and existing customers and have sales and demonstration capabilities for the company's S24 Backplane, S40 Pilot, ICT and Functional test products.
Seica was the first European company to develop and manufacture a flying probe tester for loaded boards, a platform that has been sold globally by Teradyne (and previously by GenRad). With its latest flying probe and other test technologies, Seica has emerged as a supplier of test technologies and is now backing its products with the support expected of a global player in the electronics industry.
Copyright 2004, UP Media Group. All rights reserved.
At DesignCon 2004, Winchester Electronics and Interconnect Technologies, business units of Northrop Grumman Corp. (Los Angeles, CA), and Xilinx Inc. (San Jose, CA) demonstrated the world's first implementation of a fully functioning 10 Gbps backplane reference design, manufactured using Winchester's SIP1000 I-Platform Passive Interconnect Technology, Interconnect Technologies' printed circuit board design and fabrication expertise and Xilinx Virtex-II Pro X field programmable gate arrys (FPGAs), and tested using Agilent 10 Gbps test and measurement equipment. Consistent with the input/output technology detailed in the UXPi standard, the companies demonstrated that 10 Gbps backplanes can be manufactured with off-the-shelf products and services available today.
"The inherent scalability and cost advantages of high-speed serial make this technology imperative for current and next-generation telecommunications, networking and storage applications," said Erich Goetting, vice president and general manager of the Advanced Product Group at Xilinx. "Today's demonstration proves that technology continues to push the envelope; backplanes can be built today that support 5G, 6.25G and 10G serial rates, allowing tomorrow's backplanes to be built and deployed today."
Michael P. Driscoll, president, Winchester Electronics, said, "The passive channel technology we are demonstrating at DesignCon 2004 will serve as a solid base upon which transceiver technologies for data rates of 20 Gbps and beyond will be built.The days of just selling connectors and printed circuit boards are gone and the days of selling channels have arrived. The reference design demonstrated proves that 10 Gbps in copper is a reality today."
The platform is a true interconnect platform designed to enable 10 Gbps+ serial data transmission in copper backplanes without the need for active equalization techniques. Conceived as a passive system-level interconnect, the platform seeks to reset the balance between the passive and active elements in what have become known as active interconnect systems by delivering a revolutionary new interconnect technology architecture that provides solutions for ultra high-speed, high-density differential applications.
Northrop Grumman Winchester Electronics is a provider of high-speed, high-bandwidth interconnect products, including board-to-board connectors, RF connectors, cable assemblies and power interconnects. Northrop Grumman Interconnect Technologies designs and manufactures electrical and electro-optical printed circuit boards and backpanel assemblies.
The announcement represents a major milestone in the Xilinx Serial Tsunami initiative, designed to accelerate the industry move from parallel to serial I/O technology by delivering next-generation connectivity solutions that meet bandwidth requirements from 3.125 Gbps today to 10.3125 Gbps and beyond.
Copyright 2004, UP Media Group. All rights reserved.
Indium Corp. (Utica, NY) has announced the release of a new Product Data Sheet entitled: Eutectic Gold/Tin Solder. It is available immediately as document number 97800.
Eutectic AuSn solder alloy finds use in critical applications such as high-reliability medical, aerospace and military applications; die-attach and lid sealing; or as a braze alternative. The solder's relatively high melting point and joint strength make the alloy useful for certain applications.
The document provides detailed physical properties of eutectic AuSn solder alloys and discusses applications and characteristics of the material. Performance of the solder, and the resultant solder joint, are also covered.
Indium is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
Contact Indium Corp. to obtain a copy of the product data sheet and to discuss your application.
Copyright 2004, UP Media Group. All rights reserved.
Kester (Des Plaines, IL), a supplier of interconnecting materials and related services for the electronic assembly and component assembly markets, announced that it is working with FEINFOCUS (Garbsen, Germany), a provider of high resolution X-ray microscopy and fully automated systems, to co-host two non-commercial seminars focusing on lead-free technology.
Designed to assist electronics assembly manufacturers with the reliable and cost effective implementation lead-free assembly operations, the seminar covers the main issues with lead-free soldering in surface-mount technology, wave soldering and rework operations. The seminar offers technical and practical information on how to prevent process issues usually associated with lead-free soldering. Successful case studies are also discussed showing solutions to issues normally encountered with lead-free assembly.
The seminar will provide every attendee with a Lead-Free Assembly Technical Manual containing detailed technical presentations, white papers and a subscription to the Lead-Free Connections Newsletter, mailed quarterly. The newsletter will offer process information and tech-tips to achieve solid lead-free processes. They can be used to compliment a company's training needs or knowledge base.
The first seminar is scheduled for Wednesday, Feb. 4, in Dallas, TX. The second seminar is Thursday, Feb. 5, in Austin, TX.
This series of seminars is part of the Kester University, which offers solder technology training programs coupled with consulting services to assist the electronics industry with training and process issues. For information, contact: kesteruniversity@kester.com or call Shirley Wood: (847) 699-5589.
Copyright 2004, UP Media Group. All rights reserved.
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