Gap Pad HC 5.0 thermal interface material is designed to manage heat generated by reduced form factor, high-power density components. Is a soft, compliant gap filling material; has a thermal conductivity of 5.0W/m-K and delivers outstanding thermal performance with low compression stress. Is reportedly ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.

Henkel Adhesive Technologies, www.henkel.com/brands-and-businesses/adhesive-technologies

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