Master Bond's EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Machine Vision Products' Versa Duo AOI features high-resolution optics technologies and a laser profiler to offers advanced inspection across multiple markets.
Würth Elektronik's WRIS-RSKS family of anti-sulfur resistors is aimed at manufacturers of durable electronics for applications susceptible to exposure from sulfur compounds.
Nordson Electronics Solutions' Synchro 3 selective soldering system is a new model in the SELECT Synchro series that offers up to three solder pots to match manufacturing needs for different alloys, and different or singular nozzles.
Mycronic's DeepReview automatic defect classification system leverages AI to reduce false call rates will improving first-pass-yield in 3-D AOI.
Henkel's Loctite Eccobond UF 9000AE is designed to protect large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices.