New Products
Tritan dual-lane 90 MW metallization firing system features 3600 wafers per hr., an edge-grip transport system and a temperature spike faster than 3 sec. Features TriSpeed technology, with ramp rates up to 200ºC per sec. Is a three-belt, three-speed system.
BTU International, www.btu.com
Ceramic Nozzles are for Universal Instruments’ pick-and-place machines. Include designs for Lightning Head, InLine7 Head (Flexjet) and InLine4 Head (GSM). Can place 0402, 0201 and 01005 components more accurately. Cost up to 50% less than OEM nozzle designs. 0201 nozzle geometry offers 0.0032 more vacuum than conventional OEM designs. COT oval ceramic nozzle design prevents nozzle clogging.
Count On Tools, www.cotinc.com
Fluke clamp meters and a four-channel handheld oscilloscope reduce exposure to electrical shock. Meet international standards for safe use. Can test live circuits at a distance from electrically hazardous installations. Fluke 381, 376, 375 and 374 current clamps and iFlex current probes are rated for use in measurement category IV environments (CAT IV 600V, CAT III 1000 V). Detachable display of the Fluke 381 clamp meter enables technicians to see measurements up to 33 ft. from the equipment being tested. Can see readings when the test circuit is enclosed in an equipment cabinet. ScopeMeter 190 Series II handheld portable oscilloscopes are the first four-channel scopes designed for harsh industrial environments; safety rated for CAT III 1000 V / CAT IV 600 V environments.
Fluke, www.fluke.com
S01X7C48-M500 Pb-free solder paste is a SnAg0.1Cu0.7Co+X0.03 alloy. Reportedly offers superior solder joint reliability and head-in-pillow performance over SAC 305. Is halogen-free. Has higher shear strength and greater shock absorbing ability than SnAg3Cu0.5.
Koki, www.ko-ki.co.jp
ERO-500 midrange reflow soldering system has five vertical heating zones and one cooling zone. Developed for small- to medium-volume reflow soldering of SMT and hybrid boards, and curing glue or thick-film pastes. Has a maximum system temperature of 320°C; reflow profiles can be optimized for Pb-free and SnPb profiles. Each heating zone is independently programmable and controlled via on-board LCD system controller. Reflow profiles can take into account conveyor speed, heating temperature, convection heat flow, and cooling fans. Data port included for downloading profile data and error logs.
APS Novastar, www.apsgold.com
MC-388LED is suited for LED panel assembly of up to 1.2 m in a single pass. Has 192 tape feeder capacity; performs pick-and-place for larger backplane boards requiring multi-feeders. Cognex-based on-the-fly alignment mounts any SMD from 0.4 mm x 0.2 mm to 16 mm x 14 mm, including flip-chips, CSPs and µBGAs. Upward-looking vision permits placement of larger components up to 150 mm x 100mm, BGAs, QFPs and connectors. Features ball-screw X-Y drive, closed-loop servo control with linear encoding, and placement accuracy of 30 µm, 3 sigma. Is available with two or four heads, achieving placement speeds from 6,500 to 10,000 CPH. Waffle trays and stick feeders may be accommodated in a placement area of 408 mm x 1200 mm. Conveyors for special applications are available.
Manncorp, www.manncorp.com
