New Products
Parker's Therm-A-Gap Gel 60HF high-flow thermal gel provides flow rates of up to 100g/min and is designed for companies manufacturing consumer electronics, telecommunications equipment, energy storage devices, power supplies and semiconductors, automotive control units and sensors, and computing components such as CPUs and GPUs.
Shenzhen Deepmaterial Technologies' latest range of advanced adhesive solutions includes its One Part Epoxy Adhesive, Two Part Epoxy Adhesive, and Magnet Bonding Adhesive.
Hirose's BM56 Series multi-RF board-to-board connector provides a size reduction of up to 71% compared to conventional designs.
Yincae's UF 120HA material is designed to provide a fast flow, lower-temperature cure for high-throughput application.
Vishay Intertechnology's four new series of 200V FRED Pt ultrafast rectifiers are provide space-saving, high efficiency solutions for commercial, industrial, and automotive applications. The 1A VS-1EAH02xM3, 2A VS-2EAH02xM3, 3A VS-3EAH02xM3, and 5A VS-5EAH02xM3 are each available in Vishay Automotive Grade, AEC-Q101 qualified versions.
Kurtz Ersa's Auto Scavenger Module is an extension for the Ersa HR 600 XL rework platform that is designed to enhance the efficiency and effectiveness of non-contact removal of residual solder from circuit boards.
Press Releases
- ECIA Welcomes New Manufacturers’ Council Members
- ViTrox Presents Next-Gen Intelligent Manufacturing Solutions at SEMICON Southeast Asia 2024
- IDTechEx Explores Printed Electronics in Electrified and Autonomous Mobility
- Bimos Appoints Proactive Process Solutions Group, LLC as Its Manufacturers' Representative