An in-depth study shows connection strength is most affected by the size, material and geometries of the press-fit pins, hole sizes and hole plating.

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The annual IPC trade show had more energy – and equipment – than in years past.

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The tool is ideal for localizing contamination and process control.

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A DoE of laminate, copper balance and panel configuration.

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Will through-hole components become obsolete?

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Characterization results of several Pb-free solder pastes show one capable of low-aspect ratio printing.

Ed.: Part 1 appeared in the January 2017 issue of PCD&F/CIRCUITS ASSEMBLY.

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