An in-depth study shows connection strength is most affected by the size, material and geometries of the press-fit pins, hole sizes and hole plating.
The annual IPC trade show had more energy – and equipment – than in years past.
The tool is ideal for localizing contamination and process control.
A DoE of laminate, copper balance and panel configuration.
Characterization results of several Pb-free solder pastes show one capable of low-aspect ratio printing.
Ed.: Part 1 appeared in the January 2017 issue of PCD&F/CIRCUITS ASSEMBLY.