A novel approach to predicting – and improving – device failure rates.

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Foil alloy does influence paste release, and not all alloys act the same.

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A rising tide lifted most – but not all – ships.

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What has driven stencil verification to the brink of extinction?

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Lab tests reveal decreased print variation and question whether smoother surfaces show better paste release.

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A first-of-its-kind panel of pick-and-place OEMs offers their take on flip chips, on-board inspection and the future.

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