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DfX
PCB Designers Hold Smart Factories Ransom

Many companies have ended up “just living with” multiple, repeated PCB fabrication and assembly issues for years, regarding them as a given. If smart factories are to work, however, this has to change. Here’s how.
by Michael Ford

ADDITIVE PROCESSING
Savings and Efficiencies with Printed Silver Flexible Circuits

Historically, a designer’s only recourse as electronics packaging became denser was to incorporate flexible PCBs to route traces around 3D structures. Innovations in printing and component attach are seeing light, flexible printed silver circuitry in high-density applications where more costly traditional etched copper circuits were once exclusive.
by Greg Kuchuris

SOLDERING
Mitigation of Head-in-Pillow Defect

HiP (or HoP or ball in socket) is a solder joint defect that occurs mainly with BGA, CSP and package-on-package components. Most common causes of HiP defect relate to poor wetting or component warpage. Fortunately, there are solutions.
by Jennifer Nguyen

GETTING LEAN
The Truth Behind Lean Materials

A common myth about Lean materials is they are not effective in high-mix scenarios. Advanced Lean material computerization can shave 30% of the logistics costs.
by Michael Ford

 

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