The Reflow Balancing Act
The biggest challenge for developing the profile is all components must meet the same minimum and maximum temperature requirements, even though their thermal masses are different. A new IPC standard outlines how to overcome this for machine soldering.
by Ray Prasad
Improving the PCB Assembly Manufacturing Process by an Alternative Solder Paste: A Statistical Evaluation
An evaluation of solder paste printing performance of a novel Pb-free solder paste compared to traditional solder materials under harsh environments across a range of components as small as 01005. A detailed statistical analysis identifies the relationship between the condition of the solder paste and paste volume on the pad.
by Dr. Denis Barbini
Overcertification is standard fare.