Archives

1701cover

 

FEATURES

STANDARDS
The Reflow Balancing Act

The biggest challenge for developing the profile is all components must meet the same minimum and maximum temperature requirements, even though their thermal masses are  different. A new IPC standard outlines how to overcome this for machine soldering.
by Ray Prasad

SOLDER MATERIALS
Improving the PCB Assembly Manufacturing Process by an Alternative Solder Paste: A Statistical Evaluation

An evaluation of solder paste printing performance of a novel Pb-free solder paste compared to traditional solder materials under harsh environments across a range of components as small as 01005. A detailed statistical analysis identifies the relationship between the condition of the solder paste and paste volume on the pad.
by Dr. Denis Barbini

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article