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MINIATURE TANTALUM DEVICES
New Embeddable Technologies

Developments in SMT are driven primarily by downsizing and cost reduction. Despite several decades of technical evolution, passive components still take up approximately 70% of board space, making continued miniaturization a primary design concern. In recent years, these drivers have resulted in the rapidly expanding development of embeddable components. By capitalizing on the inherent benefits of SMT, such as reduced parasitic variation due to geometry (e.g., inductance due to lead length), and incorporating a variety of enabling technologies, such as thinner dielectric layers, higher capacitance materials, and tighter termination dimensional control, engineers have successfully developed a new class of ultra-thin passive components capable of being embedded within the layers of a PCB.
by Chris Reynolds

EHS REGULATIONS
GHS: The Final Countdown

We are four months away from the deadline for implementation for the new Occupational Safety & Health Administration (OSHA) Global Harmonized System program for chemical safety. Here are the final deployment steps needed for full implementation by an electronics manufacturing facility, and its benefits to a company’s chemical introduction process, hazard identification, and emergency management and response program.
by Scott Mazur

 

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