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January 2015 cover

 

FEATURES

PACKAGING
Cost/Benefit Tradeoffs of Capacitor Part Size vs. Manufacturing Efficiency

Passives continue to eat up 70% of the board area. How smaller part sizes require less solder and can eliminate parasitic inductance.
by Chris Reynolds

COMPONENT PROCESSING
Embedded Passive Technology Materials, Design and Process

EPT can simplify assembly and test processes and reduce the actual cost, especially when using 0201 packages or lead-free processes. A summary of resistor material selection, evaluations and duplication of a complex digital design.
by Hikmat Chammas

INSPECTION
A New SPI Tool for Defect Prevention

A new automated solder paste inspection routine can check for paste volume imbalance to preempt the defects prior to component placement. Plus: Adding an on-board jet dispenser overcomes insufficients in a single step.
by Chrys Shea

DEFECTS DATABASE
Lighting the Wick

Capillary effect can thin conformal coating, but simply adding more material isn’t the answer.
by Dr. Chris Hunt

 

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