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• COVER ARTICLE
  NEMI's Lead-Free Alloy
  Still applicable to today's commercially available alloys.
  Alan Rae and Carol Handwerker

• AOI Testing Positions in Comparison
  An extensive study compares AOI following printing, placement and reflow, with surprising results.
  Peter Krippner and Detlef Beer
  Note: Click here to read the full version of this article in April's Online Exclusives.

• Total Process Control and Management, Part I
  From reliability, stability and traceability to predictability.
  Dr. Paul P.E. Wang, Jorge Martinez-Vargas, Dinesh Gill, Ramamoorthy Ganapathy Iyer and Dan Kauss

• Thermal Repeatability in Lead-Free Array Rework
  A recent study on thermal repeatability shows how even small changes in process variables can have a significant impact on the end result in lead-free array rework.
  Craig Brown

• Solder Preforms in Circuits Assembly
  New solutions for old problems.
  Mitch Holtzer

PERSPECTIVES

• Editorial

• On the Forefront
  Phil Zarrow

• Standard Features
  Jack Crawford

DEPARTMENTS

Industry News
NETgain
Market Watch
HDI/Advanced Technology
Europe Watch
The Fine Pitch - Q&A with Raymond P. Sharpe, CEO, Cookson Electronics
Assembly Insider
Ad Index
Product Spotlight
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Cover design by Javier Longoria.

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