Archives

FEATURES

  • Process Control
    Pb-Free Manufacturability and Test Control
    Lead-free solder is not a drop-in replacement electrically or mechanically. Determining the "sweet spot" between electrical contact and mechanical deformation.
    Terence Q. Collier

  • Line Automation
    Can Odd-Form Automation Increase Returns?
    Still placing odd-form parts by hand? How to determine ROI of end-of-line automation.
    Allen W. Duck and Patty Chonis

  • Cover Story
    Assessing Solder Joint Reliability in Pb-Free Assemblies
    A study finds distinctions between predictors of reliability for leaded and lead-free alloys.
    Steve Dowds

  • Screen Printing
    Throughput vs. Cycle Time in Evaluating Paste Printing
    Is the best indicator of performance machine cycle time, or first-pass yield?
    Joe Belmonte and Bob Boyes

  • Process Control
    Enabling Quick Response Manufacturing
    End manufacturing and supply-chain redundancies through software that enables flexible operations and fast changeovers.
    Doug Johnson and Vern Harrison

  • Parts Management
    Programming for Mixed-Vendor Lines
    Creating part data libraries for placement machines is time-consuming, error-prone and labor intensive. New tools can automate the process.
    Bini Elhanan

PERSPECTIVES

  • Caveat Lector
    Cracking the WIP.
    Mike Buetow

  • On the Forefront
    A hard look at solid solder deposit.
    Phil Zarrow

  • Talking Heads
    Siemens' Tilo Brandis.
    Mike Buetow

  • EMS Insight
    A challenge to the new ODMs.
    Pamela Gordon

  • ESD Basics
    A renewed need for ESD control.
    ESD Association

  • Process Doctor
    Diagnosing residue problems.
    Terry Munson

DEPARTMENTS

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On the cover: Design and process factors are the focus of this month's cover story. (photo © David Freund)

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