2018 Issues

1803cover

 

FEATURES

SOLDER VOIDING
Fill the Void III

In the third of a series of studies, several new variables were tested and compared to previous data on voiding. This round used a new board design that includes two sizes of QFNs, BGAs and LGAs susceptible to voiding, and tested multiple powder sizes.
by Tony Lentz

INEMI ROADMAP
The Ongoing Convergence of Gaming Devices

Cost, power, bandwidth and form factor of these mobile devices continue to be driving factors for acceleration of integration of silicon and system capabilities into single package or single die.
by Kartik Ananth

TEARDOWNS
Microsoft Xbox One X Teardown

A custom chip built on the AMD platform powers the popular video game console.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

1802cover

 

FEATURES

TEARDOWNS
Acer AH101 Mixed Reality VR Headset

The Acer Windows Mixed Reality virtual reality headset is small and light, with double-sided SMT and lots of flex circuits.
by Mike Buetow

MARKET FOCUS
AR/VR: The New Interfaces of Humans

The AR/VR market will grow in an augmented way, and the reality will not be a virtual one.
by Abhijit Ankalkote

HARSH ENVIRONMENTS
The Use of Particle Impact Dampers (PID) to Prevent Damage from Vibration

Excessive vibration causes premature component failure and damage to PCB assemblies in harsh environments. Such vibration and consequent failures can be mitigated using new NASA-invented devices.
by Martin Hart and Ron Hunt

STENCIL PRINTING
The Importance of Stencil Tension for High-Yield SMT Printing

An investigation of how stencil tension and condition of the foil influence the overall printing process.
by Michael Burgess and Laszlo Gyalog

SUPPLY CHAIN
Tier 3 EMS Success Creates an Unavoidable Conundrum

With factory expansion comes the time-intensive task of filling the new capacity. And that’s where many smaller EMS companies fall down.
by Joseph Fama

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

1801cover

 

FEATURES

THE SMART FACTORY
(I, Robot), Not

We are about to embark on a whole new chapter of automation, one that involves not just robots but the artificial intelligence capabilities that will eventually run them. As we contemplate the many implications, we must also find a smart way to make the automated factory work for us.
by Michael Ford

INEMI ROADMAP
The Diversity of High-End Systems

In this, the first of an occasional series highlighting the 2017 iNEMI Roadmap, the authors look at the primary segments of high-end systems – computing, networking and storage – and discuss the trends in bandwidth demands, power constraints, thermal requirements and environmental situations.
by Dale Becker

TEARDOWNS
IBM HS22V Blade Server Teardown

Going inside the popular high-density, high-performance server line, which features expandable processing and memory options.
by Mike Buetow

CERTIFICATION
Closing the Gap between ISO 9001:2008 and ISO 9001:2015

ISO 9001 continues to evolve, and the 2015 version of the standard has significant differences from the 2008 version. How one EMS implemented the new standard and is now benefitting from simplified processes and reduced document count.
by Paul Satryb

R&D
Lab One: Collaboration and Innovation

Circuits Assembly takes a tour of Comet Group’s new lab and test facility in San Jose, where RF, ebeam and x-ray technologies are assembled to help solve industry problems.
by Chelsey Drysdale

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK