MILPITAS, CA – FlexTech, a SEMI Technology Community focused on driving flexible hybrid electronics (FHE) innovations, today issued a Request for Proposals (RFP) for advances in innovative materials, FHE design tools, additive-enabled processing, hybrid electronics packaging, FHE manufacturing, AI/ML applications, soft robotics, and power solutions. Selected projects will receive cash awards ranging from $250,000 to $1 million. The program is funded by the Army Research Laboratory (ARL).

Organizations submitting proposals will be evaluated based on their capabilities, experience, and strengths including team diversity. See the SEMI FlexTech 2023 Request for Proposals for more details on the evaluation process.

White paper submissions, the first step in responding to the RFP, are due June 5, 2023. To help organizations prepare their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on May 25, 2023, at 10:00 a.m. PDT. The webinar is open to organizations considering submitting a proposal. A recording will be available for registrants unable to attend the event. Registration for the event is open.

Following the review of white papers by the RFP Review Committee, consisting of FlexTech Council members and other subject matter experts (SMEs), FlexTech will invite selected organizations to submit full proposals. The evaluation criteria include:

• Rationale
• Budget
• Collaboration value
• Dual-use (industry and military) applicability
• Relevance to the FHE ecosystem
• Schedules and milestones
• Reasonable and stretch deliverables
• Overall proposal quality

FlexTech supports technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals. Research and development efforts funded by FlexTech are in the U.S. government’s Technology Readiness Level (TRL) and Manufacturing Readiness Level (MRL).

FlexTech encourages partnerships among industrial companies, R&D organizations, and university teams. ARL funding will be matched with contributions by grant recipients to cover the total project cost. Development partners retain ownership of intellectual property developed under FlexTech contracts.

SALEM, NH – Emerald EMS, an innovative solutions provider, is pleased to announce plans to exhibit in Booth #932 at MD&M East, scheduled to take place June 13-15, 2023 at the Jacob Javits Convention Center in New York, NY. The Emerald EMS team is driving design, engineering and manufacturing forward.

Emerald EMS assists original equipment manufacturing (OEM) companies and suppliers for life sciences in developing artifical intelligence, machine learning, robotics, distruptive digital health device design and innovative new materials. All of this while ensuring compliance with the industry’s uniquely stringent requirements for accuracy, reliability and patient safety.

In a time when the demand for advanced medical technology seems endless and constantly evolving, Emerald EMS equips its valued customers to meet the challenges and potential of this exciting era of exploration and human progress. All of Emerald EMS’s ISO-13485-certified U.S. manufacturing facilities have established track records as leading providers of electronic manufacturing services for high-reliability life science and patient safety applications.

Equipped with the latest manufacturing equipment available on the market, Emerald EMS offers electro-mechanical and system assembly, reliability, precision touch-ups, in-circuit and functional tests, rework and failure analysis, complex repair depot services, final test, integration, box builds, order configuration and direct order fulfillment. Additionally, the company offers a wide variety of sophisticated SMT placement and clean room assembly.

Emerald EMS is committed to fully understanding and meeting the needs of their customers through quality excellence, advanced engineering, and strong commitment to customer relationships.

Contact us here to schedule a meeting at MD&M East or visit www.emeraldems.com to learn more.

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is proud to announce its latest webinar series, "Advanced Packaging and Power Electronics: A Webinar Series on the Latest Innovations, Cleaning, and Corrosion Challenges."

This free webinar series will explore the latest innovations in advanced packaging and power electronics and the cleaning and corrosion challenges associated with these technologies. Each 45-minute webinar will be followed by a 15-minute Q&A session, allowing attendees to ask questions and gain valuable insights from ZESTRON's industry experts.

The webinar series will cover the following topics:

• Enhancing Performance of Copper Pillar Interconnects through Defluxing
• Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs
• Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components
• Corrosion in Power Electronics–ZESTRON Europe; Reliability and Surfaces Team

Registration for the webinar series is now open, and interested individuals can sign up for free at: https://pages.zestron.com/2023-webinars-1 

SINGAPORE – Over the past three decades, Venture has grown its business, evolving from an electronics services provider to become a successful global provider of technology services, products and solutions in technology domains today. The company has recorded consistent growth over the years with a workforce of more than 12,000 employees. While its base is Singapore, the company has operations that span key global markets such as Malaysia, China, USA, and Europe.

To ready itself for the next decade, the Group has announced a reorganisation of its business groupings and key leadership appointments with effect from 1 June 2023. The Venture Group will be restructured to form two technology business groups, known as Technology Products & Solutions (TPS) group and Advanced Manufacturing & Design Solutions (AMDS) group. TPS and AMDS will each be led by a CEO.

TPS businesses comprise primarily the Life-Science & Genomics domain, the Custom Design Business (focused on leading-edge Biotech and medical equipment) and the Solutions & Strategic Modules Business, all of which were recently corporatised as the Ventech Group. TPS will also oversee the Precision Engineering Business, presently undertaken by entities under the Univac Group. Mr Lee Ghai Keen will head the businesses under TPS as its CEO.

AMDS group of businesses are engaged in the design and manufacture of a wide range of sophisticated electronic products, including products within the Healthcare, Luxury Lifestyle and Wellness domain, Semi-Conductor related equipment and modules, and several other emerging tech domains. Mr Wong Chee Kheong, currently Venture’s Group COO, will head the AMDS group of businesses as its CEO.