SAN JOSE – A projected decline in world semiconductor fab equipment spending of 20% is expected for 2008, but a rebound of more than 20% in spending is expected in 2009, driven by more than 70 fab projects, says SEMI
In 2008, 300-mm projects make up about 90% of all fab equipment spending, while about 69% of all equipment spending is for 65-nm and below technology nodes, according to the association.
Overall annual semiconductor fab capacity this year is expected to be about 16 million wafers, a growth rate of just 9% compared to 17% capacity growth in 2007. In 2009, capacity is expected to grow about 10%.
Memory makes up the largest share of total semiconductor fab capacity, with a 40% share in 2008, followed by foundries with more than 20%, and logic with 15%.
In 2009, memory will slightly increase its share to 42%, while foundries and logic are forecasted to remain at about the same share levels, says SEMI.
There have been dramatic changes in spending on fab construction projects. Many projects have been delayed during 2008 (with a 38% decline in construction spending year-over-year), but 2009 will show more than 50% growth in construction spending when many of the pushed out projects begin.
Over most of the past decade, Japan has spent the largest share of money on fabs equipping. This will change in 2009, with Taiwan and S. Korea exceeding Japan in fab equipment and construction spending. By 2009, the share in total spending throughout the Asia Pacific region (excluding Japan) will rise to more than 67% (from 50% in 2006). In 2008, only four semiconductor companies spent more than $1.5 billion. In 2009, twice as many will spend at that level, says SEMI. 
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