February 2014 cover

 

FEATURES

STENCIL CLEANING
Reducing Stencil Wipe Frequency
Do nanocoatings really extend stencil underwipe intervals? As part of a stencil study, two nanocoated fine-grain stencils were evaluated using a complex test vehicle. The investigators expected a tenfold extension of wipe intervals would show a definite decline in print quality. The results were amazing – and unexpected.
by Chrys Shea and Ray Whittier

REFLOW PROFILING
The Basics of Thermal Profiling for Sensitive Components
Today’s boards are designed with a broad mix of large and small parts, which complicates development of the right thermal profile. Finding a temperature setting that’s acceptable to both larger and smaller packages, while juggling tradeoffs and special considerations, is a balancing act. Here’s how to navigate it.
by Simon Ilustre

PARTNERSHIPS
A Systems-Level Approach to Product Development
Are OEMs missing out on technology improvements because of disconnects with their primary suppliers? And if so, could a change in the structure between the two groups serve to expedite the rate of new technology development and implementation?
by Matt Perry and Zhiwei Cai

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

 

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