2014 Issues

June 2014 cover

 

FEATURES

DFM
Design Practices for Panelization and Depanelization
Panelization keeps small boards attached to each other within a single, larger substrate. Using arrays benefits the fabricator and the assembler. Here’s how the designer can help.
by Phil Lerma

EMS TOP 50
A Muddled Recovery
The EMS industry is recovering, but not broadly, with at least 22 of the top 50 companies experiencing lower sales last year, some by a billion or more.
by Mike Buetow

TEST AND INSPECTION
Manufacturing Test Solutions for SSDs
The setup and advantages of using a full solution, including a benchtop boundary scan tool, measurement instrumentation and programmable power supply, with both hardware and software integrated, unpowered short and open test and voltage measurement.
by Jun Balangue

GOLDEN WEST TECHNOLOGY
‘We’re Not Making Toys’
At 40 years and counting, Orange County’s longest-operating EMS is all about reliability.
by Chelsey Drysdale

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

 

May 2014 cover

 

FEATURES

COMPONENT PACKAGING
Power Electronics Packages with Embedded Components – Recent Trends and Developments
Power electronics packaging applications are in strong demand for their reliability and cost. Development work ranges from low-power converter modules, over single or multichip MOSFET or IGBT packages, to high-power applications. Recent developments toward module realization for high-power automotive applications include the screening and use of organic substrate materials for embedding and thermal management, as well as interconnection materials for die, module and heatsink assembly.
by Lars Boettcher, Stefan Karaszkiewicz, Dionysios Manessis and Andreas Ostmann

STENCIL DESIGN
Automating Stencil Design
Stencil design calculation capability is not new to electronics manufacturing, but evolving software tools have brought about much-needed sophistication to stencil design calculations and analyses, all while slicing the time it takes to perform the calculations.
by Chrys Shea

EMS MANAGEMENT
A Public-Private Partnership That Works
One of the big hurdles in the reshoring trend is recruiting new talent as jobs come back. How one smaller EMS, faced with a doubling of its workforce, adapted.
by Tony Bellitto

IPC APEX EXPO RECAP
Good Values in Vegas
LEDs and 03105 package styles were the main topics of conversation, but – surprisingly? – what really stood out at the annual IPC trade show was the exhibitors’ good vibes.
by Mike Buetow (photos by Rebekah Venturini)

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

 

April 2014 cover

 

FEATURES

DESIGN QUALIFICATION
Qualification vs. First Article Inspection
Military and commercial product suppliers often overlook what is being asked by their customer when they are asked to qualify a part. What’s more, there’s a disconnect between what FAI is and whether it is a sufficient technique for design qualification.
by Charles Hill and Karen Ebner

DECAPSULATION
Circuits Disassembly: Materials Characterization and Failure Analysis
Common procedures for encapsulant removal apply to most applications. When standard procedures don’t work, however, there are methods that, while unconventional, have proved successful.
by W. John Wolfgong, PH.D., Jana Julien, Jason Wheeler and Joe Colangelo

PCB CLEANING
Advances in Concentration Monitoring and Closed-Loop Control
How does one accurately determine the concentration of chemistry, or an aqueous-based cleaning solution that comprises flux residues, as well as a wide variety of SMT-related residues that are entrained in a cleaning system wash bath? New sensor-based technology is doing so, and with greater accuracy than conventional methods.
by Umut Tosun, Axel Vargas and Bryan Kim, Ph.D.

MURRIETTA CIRCUITS
The One-Stop SoCal Shop

For over 30 years, the family-run Southern California company has been adding services to its printed circuit roots.
by Chelsey Drysdale

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

 

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