October 2013 cover

 

FEATURES

COMPONENTS
A Custom BGA for Particle Physics Experiments
Deep inside the CERN collider, detectors capture faint electrical signals the particles produce during their transit. How a novel high-yield and higher functioning BGA package was designed to replace a more expensive COB part in the sensors.
by Benjamin Buck

CFTI
Metals from Africa
One of the biggest names in electronics – Philips – is out to change the fate of the Congolese people. In the process, the MNC has teamed with a pair of behind-the-scenes suppliers and a Dutch prince to revamp the electronics supply chain and overcome the Dodd-Frank Act.
by Mike Buetow

COMPONENT PLACEMENT
Improving Placement Modularity through Shared Resources
By maximizing the flexibility of existing equipment, and sharing equipment resources, assemblers can eliminate duplication and speed component placement.
by Matt Wyglendowski

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article